Hot Bar Soldering Design Rules

Design tips for successful hot bar reflow.

Hot bar soldering design rules. Hot bar reflow soldering bonding fundamentals technical articles and whitepapers blogs videos training information and more. Hot bar reflow soldering systems. Hot bar soldering in this method resistance soldering a heated stamp also cal led bar or thermode is pressing with an adjustable programmable force on the two parts to be joined one lying on top of the other. Flex carriers and foil connectors.

Mobile electronics such as telecommunications equipment as well as the electronics in motor vehicles require increasing packing density and thus arrangement of the circuits in multiple layers. Excessive differences in the heat continue reading pcbs. Design tips for successful hot bar reflow soldering. 3 layouts for hot bar reflow soldering.

The parts are then cooled below the solidification temperature to form a permanent electro mechanical bond. Most pcb materials like fr2 and fr4 are very resilient to the application of heat during the hot bar reflow soldering or hot bar bonding process. Flex and pcb designs 1109 08 2010. Hot bar reflow soldering.

The temperature of the stamp transfers the required heat into the joint to be soldered. Although normal solder will melt at 180 c ideal solder temperature is above 220 c to get a good flowing and wetting behavior but below 280 c to prevent burning of the solder. Solder must be pre tinned on pcb prior to hot bar process start point for screen printing is a 150 microns thick stencil with a mask opening that results in a 40 pad coverage for small pitch applications it is recommended to pre tin the parts by electro plating as being the most accurate technology. Hot bar touches the leads 400 c hot bar touches kapton or 500 c ceramics and mc pcb soldering.

The hot bar must be set higher due to the thermal transfer losses.